Display panel and display apparatus including the same

ABSTRACT

A display panel includes: a substrate including a main display area, a first component area, a second component area, and a peripheral area; a first subpixel on the main display area, and a first pixel circuit connected to the first subpixel; a second subpixel on the first component area; a second pixel circuit spaced apart from the second subpixel; and a connection wiring connecting the second subpixel to the second pixel circuit.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to and the benefit of KoreanPatent Application No. 10-2020-0112545, filed on Sep. 3, 2020, in theKorean Intellectual Property Office, the entire disclosure of which isincorporated herein by reference.

BACKGROUND 1. Field

Aspects of one or more example embodiments relate to a display panel anda display apparatus including the display panel.

2. Description of Related Art

Recently, the various uses and applications for display apparatuses hasbecome more diversified. Also, as display apparatuses have becomethinner and more lightweight, their range of use has widened.

As display apparatuses are used for various purposes, there are variousmethods of designing the display apparatuses of various shapes, and thenumber of functions to be combined with or linked to display apparatuseshas increased.

The above information disclosed in this Background section is only forenhancement of understanding of the background and therefore theinformation discussed in this Background section does not necessarilyconstitute prior art.

SUMMARY

Aspects of one or more example embodiments include a display panel witha display area extended to display an image even in an area where acomponent as an electronic element is arranged, and a display apparatusincluding the display panel. However, the one or more embodiments areonly examples, and the scope of embodiments according to the presentdisclosure are not limited thereto.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments of the disclosure

According to one or more example embodiments, a display panel includes asubstrate including a main display area, a first component area, asecond component area, and a peripheral area, a first subpixel on themain display area, and a first pixel circuit connected to the firstsubpixel, a second subpixel on the first component area, a second pixelcircuit spaced apart from the second subpixel, and a connection wiringconnecting the second subpixel to the second pixel circuit.

According to some example embodiments, the second pixel circuit may belocated in the peripheral area.

According to some example embodiments, the connection wiring may includea transparent conductive material.

According to some example embodiments, the display panel may furtherinclude an additional connection wiring connecting the connection wiringto the second pixel circuit, and the additional connection wiring mayinclude a material different from a material of the connection wiring.

According to some example embodiments, the first subpixel and the secondsubpixel may emit the same color, and a size of the second subpixel maybe greater than a size of the first subpixel.

According to some example embodiments, the second pixel circuit may bebetween the first component area and the second component area.

According to some example embodiments, the display panel may furtherinclude a third subpixel between the first component area and the secondcomponent area.

According to some example embodiments, the third subpixel may beconnected to a third pixel circuit arranged in the peripheral area.

According to some example embodiments, the display panel may furtherinclude a main scan line extending in a first direction, and a scanconnection line connected to the main scan line.

According to some example embodiments, the scan connection line maysurround one side of the first component area.

According to some example embodiments, the scan connection line may bein the peripheral area.

According to some example embodiments, the first subpixel may include afirst pixel electrode and a first emission layer, and the secondsubpixel may include a second pixel electrode and a second emissionlayer.

According to some example embodiments, the display panel may furtherinclude an opposite electrode on each of the first emission layer andthe second emission layer, and an upper layer on the opposite electrode.An end of the opposite electrode and an end of the upper layer maycoincide with each other.

According to some example embodiments, the first pixel electrode or thesecond pixel electrode and the connection wiring may be formed by thesame process.

According to some example embodiments, the display panel may furtherinclude a bottom metal layer on the first component area.

According to some example embodiments, the display panel may furtherinclude a dummy subpixel located inbetween the peripheral area or thefirst component area and the second component area.

According to some example embodiments, the substrate may further includea third component area.

According to one or more example embodiments, a display apparatusincludes a display panel including a substrate, the substrate includinga main display area, a first component area, a second component area,and a peripheral area, a first component below the display panel tocorrespond to the first component area, and a second component below thedisplay panel to correspond to the second component area, wherein thedisplay panel includes a first subpixel on the main display area, and afirst pixel circuit connected to the first subpixel, a second subpixelon the first component area, a second pixel circuit spaced apart fromthe second subpixel, and a connection wiring connecting the secondsubpixel to the second pixel circuit.

According to some example embodiments, the first component and thesecond component may each include at least one of a proximity sensor, anilluminance sensor, an RGB sensor, an infrared sensor, a fingerprintrecognition sensor, an ultrasonic sensor, an optical sensor, amicrophone, an environmental sensor, a chemical sensor, or a radarsensor.

According to some example embodiments, the substrate may further includea third component area, and the display apparatus may further include athird component arranged to correspond to the third component area.

Other aspects, features, and characteristics other than those describedabove will become apparent from the following detailed description,claims and drawings for carrying out the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and characteristics of certainexample embodiments of the disclosure will be more apparent from thefollowing description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view schematically illustrating a displayapparatus according to some example embodiments;

FIGS. 2A and 2B are cross-sectional views each schematicallyillustrating a portion of a cross-section of a display apparatusaccording to some example embodiments;

FIGS. 3A and 3B are plan views each schematically illustrating a displaypanel that may be included in the display apparatus of FIG. 1 accordingto some example embodiments;

FIG. 4 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments;

FIG. 5 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments;

FIG. 6 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments;

FIG. 7 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments;

FIG. 8 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments;

FIG. 9 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments;

FIG. 10 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 11 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 12 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 13 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 14 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 15 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 16 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 17 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 18 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 19 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 20 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 21 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 22 is a schematic cross-sectional view illustrating a portion of adisplay panel, for example, a first component area, and a peripheralarea, according to some example embodiments;

FIG. 23 is a schematic cross-sectional view illustrating a portion of adisplay panel according to some example embodiments;

FIG. 24 is a schematic cross-sectional view illustrating a portion of adisplay panel according to some example embodiments;

FIG. 25 is a schematic cross-sectional view illustrating a portion of adisplay panel according to some example embodiments;

FIG. 26 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments;

FIG. 27A to 27D are schematic cross-sectional views each illustrating aportion of a display panel according to some example embodiments; and

FIGS. 28 and 29 are perspective views each illustrating a displayapparatus in use according to some example embodiments.

DETAILED DESCRIPTION

Reference will now be made in more detail to aspects of some exampleembodiments, examples of which are illustrated in the accompanyingdrawings, wherein like reference numerals refer to like elementsthroughout. In this regard, the present embodiments may have differentforms and should not be construed as being limited to the descriptionsset forth herein. Accordingly, the embodiments are merely describedbelow, by referring to the figures, to explain aspects of the presentdescription. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items. Throughoutthe disclosure, the expression “at least one of a, b or c” indicatesonly a, only b, only c, both a and b, both a and c, both b and c, all ofa, b, and c, or variations thereof.

As the disclosure allows for various changes and numerous embodiments,certain embodiments will be illustrated in the drawings and described indetail in the written description. The attached drawings forillustrating embodiments of the present disclosure are referred to inorder to gain a sufficient understanding of the present disclosure, themerits thereof, and the objectives accomplished by the implementation ofthe present disclosure. The disclosure may, however, be embodied in manydifferent forms and should not be construed as being limited to theembodiments set forth herein.

Hereinafter, aspects of some example embodiments will be described inmore detail with reference to the accompanying drawings. When describingembodiments with reference to the accompanying drawings, the same orcorresponding elements are denoted by the same reference numerals and aredundant description thereof will be omitted.

It will be understood that when a component, such as a layer, a film, aregion, or a plate, is referred to as being “on” another component, thecomponent can be directly on the other component or interveningcomponents may be present thereon. Sizes of elements in the drawings maybe exaggerated for convenience of description. For example, becausesizes and thicknesses of components in the drawings are arbitrarilyillustrated for convenience of explanation, the following embodimentsare not limited thereto.

In the following embodiments, the x-axis, the y-axis and the z-axis arenot limited to three axes of the rectangular coordinate system, and maybe interpreted in a broader sense. For example, the x-axis, the y-axis,and the z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another.

FIG. 1 is a perspective view schematically illustrating a displayapparatus 1 according to some example embodiments.

Referring to FIG. 1 , the display apparatus 1 may include a display areaDA and a peripheral area DPA outside the display area DA. The displayarea DA may include a first component area CA1 and a main display areaMDA at least partially surrounding the first component area CA1. Thatis, the first component area CA1 and the main display area MDA maydisplay an image individually or together. The peripheral area DPA maybe a type of non-display area in which display elements are notarranged. The display area DA may be entirely surrounded by theperipheral area DPA.

According to some example embodiments, FIG. 1 shows that two componentareas, that is, first and second component areas CA1 and CA2 are in themain display area MDA. According to some example embodiments, thedisplay apparatus 1 may include three or more component areas, andshapes and sizes of the plurality of component areas may be differentfrom one another. In a view in a direction substantially perpendicularto the upper surface of the display apparatus 1, the component area mayhave various shapes such as circular shapes, elliptical shapes, andpolygonal shapes such as tetragonal shapes, star shapes, or diamondshapes. In addition, FIG. 1 illustrates that the component area is atthe upper center (in the +y direction) of the main display area MDAhaving a substantially rectangular shape in a view in a directionsubstantially perpendicular to the upper surface of the displayapparatus 1; however, the component area may be at one side of the maindisplay area MDA having a rectangular shape, for example, at the upperright side or the upper left side thereof.

The display apparatus 1 may provide an image by using first subpixels P1in the main display area MDA and second subpixels P2 in the firstcomponent area CA1. According to some example embodiments, subpixels maynot be in the second component area CA2. According to some exampleembodiments, subpixels may be also in the second component area CA2.

As described below with reference to FIG. 2A, a component 40 as anelectronic element may be below a display panel to correspond to thefirst component area CA1. The component 40 may include at least one of aproximity sensor, an illuminance sensor, an RGB sensor, an infraredsensor, a fingerprint recognition sensor, an ultrasonic sensor, anoptical sensor, a microphone, an environmental sensor, a chemicalsensor, or a radar sensor. In order to minimize or reduce the limitationof the function of the component 40, the first component area CA1 mayinclude a transmission area TA that may transmit light and/or soundoutput from the component 40 to the outside or propagating toward thecomponent 40 from the outside. According to some example embodiments,when light is transmitted through the first component area CA1, thelight transmittance thereof may be about 10% or more, for example, about40% or more, about 25% or more, about 50% or more, about 85% or more, orabout 90% or more.

A component 40, which is an electronic element, may be below the displaypanel to correspond to the second component area CA2.

According to some example embodiments, an optical sensor such as acamera may be below the first component area CA1 in which a subpixel isprovided, and a high-resolution sensor such as a radar sensor may bebelow the second component area CA2 in which no subpixel is provided.

The second subpixels P2 may be in the first component area CA1. Thesecond subpixels P2 may emit light to provide a certain image. The imagedisplayed in the first component area CA1 may be an auxiliary image andmay have a lower resolution than an image displayed in the main displayarea MDA. That is, the first component area CA1 may include atransmission area TA through which light and sound may be transmitted.When no subpixel is in the transmission area TA, the number of secondsubpixels P2 that may be arranged per unit area therein may be less thanthe number of first subpixels P1 arranged per unit area in the maindisplay area MDA.

According to some example embodiments, the second subpixels P2 may alsobe in the second component area CA2. The second subpixels P2 may eachemit light to provide a certain image. The image displayed in the secondcomponent area CA2 is an auxiliary image and may have a lower resolutionthan the image displayed in the main display area MDA. That is, thesecond component area CA2 may include a transmission area TA throughwhich light and sound may be transmitted. When no subpixel is in thetransmission area TA, the number of second subpixels P2 that may bearranged per unit area therein may be less than the number of firstsubpixels P1 arranged per unit area in the main display area MDA.

FIGS. 2A and 2B are cross-sectional views each schematicallyillustrating a portion of a cross-section of the display apparatus 1according to some example embodiments.

Referring to FIG. 2A, the display apparatus 1 may include a displaypanel 10 and the component 40 overlapping the display panel 10. A coverwindow for protecting the display panel 10 may be further above thedisplay panel 10.

The display panel 10 may include a first component area CA1 overlappingthe component 40 and a main display area MDA, where a main image isdisplayed. The display panel 10 may include a substrate 100, a displaylayer DISL on the substrate 100, a touch screen layer TSL, an opticalfunctional layer OFL, and a panel protection member PB below thesubstrate 100. According to some example embodiments, it may beunderstood that the substrate 100 included in the display panel 10includes the first component area CA1 and the main display area MDA,where a main image is displayed.

The display layer DISL may include a circuit layer PCL includingthin-film transistors TFT and TFT′, a display element layer EDLincluding organic light-emitting diodes OLED and OLED′ as a displayelement, and an encapsulation member ENCM such as a thin-filmencapsulation layer TFEL or a sealing substrate. Insulating layers ILand IL′ may be in the display layer DISL and between the substrate 100and the display layer DISL.

The substrate 100 may include an insulating material such as glass,quartz, or polymer resin. The substrate 100 may include a rigidsubstrate or a flexible substrate that is bendable, foldable, orrollable.

A first pixel circuit PC1 and a main organic light-emitting diode OLEDconnected thereto may be in the main display area MDA of the displaypanel 10. The first pixel circuit PC1 includes at least one thin-filmtransistor TFT, and may control emission of the main organiclight-emitting diode OLED. The first subpixel P1 may be implemented byemission of the main organic light-emitting diode OLED.

An auxiliary organic light-emitting diode OLED′ may be in the firstcomponent area CA1 of the display panel 10 to implement the secondsubpixel P2. According to some example embodiments, the second pixelcircuit PC2 driving the auxiliary organic light-emitting diode OLED′ maynot be in the first component area CA1, but may be in a peripheral areaDPA, which is a non-display area. According to some example embodiments,the second pixel circuit PC2 may be in the main display area MDA or maybe between the first component area CA1 and the second component areaCA2 (see FIG. 1 ). The second pixel circuit PC2 may be in variouslocations. That is, the second pixel circuit PC2 may not overlap theauxiliary organic light-emitting diode OLED′.

The second pixel circuit PC2 includes at least one auxiliary thin-filmtransistor TFT′, and may be electrically connected to the auxiliaryorganic light-emitting diode OLED′ by a connection wiring TWL. Theconnection wiring TWL may include a transparent conductive material. Thesecond pixel circuit PC2 may control emission of the auxiliary organiclight-emitting diode OLED′. The second subpixel P2 may be implemented byemission of the auxiliary organic light-emitting diode OLED′. An area inwhich the auxiliary organic light-emitting diode OLED′ is arranged inthe first component area CA1 may be referred to as an auxiliary displayarea ADA.

In addition, an area in which the auxiliary organic light-emitting diodeOLED′, which is a display element, is not arranged in the firstcomponent area CA1 may be referred to as a transmission area TA. Thetransmission area TA may be an area through which light or a signalemitted from the component 40 arranged to correspond to the firstcomponent area CA1 or light or a signal incident on the component 40 istransmitted. The auxiliary display area ADA and the transmission area TAmay be alternately arranged in the first component area CA1. Theconnection wiring TWL connecting the second pixel circuit PC2 to theauxiliary organic light-emitting diode OLED′ may be in the transmissionarea TA. The connection wiring TWL may include a transparent conductivematerial having a high transmittance, and thus, the transmittance of thetransmission area TA may be secured, even when the connection wiring TWLis in the transmission area TA.

Because the second pixel circuit PC2 is not in the first component areaCA1, an area of the transmission area TA may be secured, and thus, thelight transmittance thereof may be further improved.

The display element layer EDL may be covered by the thin-filmencapsulation layer TFEL or may be covered by a sealing substrate. Insome embodiments, the thin-film encapsulation layer TFEL may include atleast one inorganic film layer and at least one organic film layer asshown in FIG. 2 . According to some example embodiments, the thin-filmencapsulation layer TFEL may include a first inorganic film layer 131, asecond inorganic film layer 133, and an organic film layer 132therebetween.

The first inorganic film layer 131, and the second inorganic film layer133 may include one or more inorganic insulating materials such assilicon oxide (SiO₂), silicon nitride (SiN_(X)), silicon oxynitride(SiO_(X)N_(Y)), aluminum oxide (Al₂O₃), titanium oxide (TiO₂), tantalumoxide (Ta₂O₅), and may be formed by chemical vapor deposition (CVD) orthe like. The organic film layer 132 may include a polymer-basedmaterial. The polymer-based material may include a silicon-based resin,an acryl-based resin, an epoxy-based resin, polyimide, polyethylene, andthe like.

The first inorganic film layer 131, the organic film layer 132, and thesecond inorganic film layer 133 may be integrally formed to cover themain display area MDA and the first component area CA1. Further,according to some example embodiments, the first inorganic film layer131, the organic film layer 132, and the second inorganic film layer 133may also cover the second component area CA2 (see FIG. 1 ).

When the display element layer EDL is sealed by the sealing substrate,the sealing substrate may face the substrate 100 with the displayelement layer EDL therebetween. There may be a gap between the sealingsubstrate and the display element layer EDL. The sealing substrate mayinclude glass. A sealant including frit or the like may be between thesubstrate 100 and the sealing substrate, and the sealant may be in theperipheral area DPA described above. The sealant in the peripheral areaDPA may surround the display area DA to prevent moisture frompenetrating through the side surface thereof.

The touch screen layer TSL may be configured to obtain coordinateinformation according to an external input, for example, a touch event.The touch screen layer TSL may include a touch electrode and touchwirings connected to the touch electrode. The touch screen layer TSL maysense an external input by using a self capacitance method or a mutualcapacitance method.

The touch screen layer TSL may be formed on the thin-film encapsulationlayer TFEL. Alternatively, the touch screen layer TSL may be separatelyformed on a touch substrate, and then, may be coupled onto the thin-filmencapsulation layer TFEL through an adhesive layer such as an opticalclear adhesive (OCA). According to some example embodiments, the touchscreen layer TSL may be directly formed on the thin-film encapsulationlayer TFEL, and in this case, an adhesive layer may not be between thetouch screen layer TSL and the thin-film encapsulation layer TFEL.

The optical functional layer OFL may include an anti-reflection layer.The anti-reflection layer may reduce the reflectance of light (externallight) incident from the outside toward the display apparatus 1.

According to some example embodiments, the optical functional layer OFLmay include a polarization film. The optical functional layer OFL mayinclude an opening OFL_OP corresponding to the transmission area TA.Accordingly, the light transmittance of the transmission area TA may besignificantly improved. The opening OFL_OP may be filled with atransparent material such as optically clear resin (OCR).

According to some example embodiments, the optical functional layer OFLmay be provided as a filter plate including a black matrix and colorfilters.

The panel protection member PB may be attached under the substrate 100to support and protect the substrate 100. The panel protection member PBmay include an opening PB_OP corresponding to the first component areaCA1. By providing the opening PB_OP in the panel protection member PB,the light transmittance of the first component area CA1 may be improved.The panel protection member PB may include polyethylene terephthalate orpolyimide. According to some example embodiments, the panel protectionmember PB may include an opening corresponding to the second componentarea CA2 (see FIG. 1 ). By providing the opening PB_OP in the panelprotection member PB, the light transmittance of the second componentarea CA2 may be improved.

An area of the first component area CA1 may be greater than an areawhere the component 40 is arranged. Accordingly, an area of the openingPB_OP in the panel protection member PB may not coincide with the areaof the first component area CA1.

In addition, a plurality of components 40 may be in the first componentarea CA1. The plurality of components 40 may have different functions.For example, the plurality of components 40 may include at least two ofa camera (an imaging device), a solar cell, a flash, a proximity sensor,an illuminance sensor, and an iris sensor.

In FIG. 2A, the bottom metal layer BML is not arranged below theauxiliary organic light-emitting diode OLED′ of the first component areaCA1, but as shown in FIG. 2B, the display apparatus 1 may include abottom metal layer BML that overlaps the auxiliary organiclight-emitting diode OLED′.

The bottom metal layer BML may be between the substrate 100 and theauxiliary organic light-emitting diode OLED′ and may overlap theauxiliary organic light-emitting diode OLED′. The bottom metal layer BMLmay block the external light from reaching the auxiliary organiclight-emitting diode OLED′. Meanwhile, the bottom metal layer BML may beformed to correspond to the entire auxiliary display area ADA, and mayinclude a lower-hole corresponding to the transmission area TA. In thiscase, the lower-hole may be provided in various shapes such as apolygonal, a circular, or an amorphous shape, and may adjust thediffraction characteristic of external light.

FIGS. 3A and 3B are plan views each schematically illustrating a displaypanel 10 that may be included in the display apparatus 1 of FIG. 1according to some example embodiments.

Referring to FIG. 3A, various components included in the display panel10 may be on the substrate 100. The substrate 100 may include a displayarea DA and a peripheral area DPA surrounding the display area DA. Thedisplay area DA may include a main display area MDA, where a main imageis displayed, and a first component area CA1, which includes atransmission area TA and in which an auxiliary image is displayed. Theauxiliary image may form a full image together with the main image, andthe auxiliary image may form an image independent from the main image.Further, the substrate 100 may include a second component area CA2. Thesecond component area CA2 may also include a transmission area TA.According to some example embodiments, the first component area CA1 andthe second component area CA2 may be spaced apart in a first direction(the x-direction). According to some example embodiments, the firstcomponent area CA1 and the second component area CA2 may be spaced apartin a second direction (the y-direction) intersecting with the firstdirection (the x-direction).

First subpixels P1 may be in the main display area MDA. Each of thefirst subpixels P1 may be implemented by a display element such as anorganic light-emitting diode OLED. A first pixel circuit PC1 driving thefirst subpixel P1 is in the main display area MDA, and may overlap thefirst subpixel P1. Each first subpixel P1 may emit, for example, red,green, blue, or white light. The main display area MDA may be coveredwith an encapsulation member to be protected from ambient air ormoisture.

The first component area CA1 may be at one side of the main display areaMDA as described above or may be inside the main display area MDA andsurrounded by the main display area MDA. Second subpixels P2 may be inthe first component area CA1. Each of the second subpixels P2 may beimplemented by a display element such as an organic light-emittingdiode. A second pixel circuit PC2 driving the second subpixel P2 may bein the peripheral area DPA that is close to the first component areaCA1. For example, when the first component area CA1 is above the maindisplay area MDA, the second pixel circuit PC2 may be above theperipheral area DPA. The second pixel circuit PC2 and a display elementimplementing the second subpixel P2 may be connected to each other by aconnection wiring TWL extending in a second direction (the y-direction).

Each second subpixel P2 may emit, for example, red, green, blue, orwhite light. The first component area CA1 may be covered with anencapsulation member to be protected from ambient air or moisture.

Meanwhile, the first component area CA1 may include the transmissionarea TA. The transmission area TA may surround a plurality of secondsubpixels P2. Alternatively, the transmission area TA may be arranged ina grid form with the second subpixels P2.

The second component area CA2 may be spaced apart from the firstcomponent area CA1 in the first direction (the x-direction). Accordingto some example embodiments, the second subpixels P2 may not be in thesecond component area CA2. According to some example embodiments, thesecond subpixels P2 may be in the second component area CA2. The secondcomponent area CA2 may include the transmission area TA.

Because the first component area CA1 includes the transmission area TA,a resolution of the component area CA may be less than a resolution ofthe main display area MDA. For example, the resolution of the firstcomponent area CA1 may be about ½, ⅜, ⅓, ¼, 2/9, ⅛, 1/9, or 1/16 that ofthe resolution of the main display area MDA. For example, the resolutionof the main display area MDA may be about 400 ppi or more, and theresolution of the first component area CA1 may be about 200 ppi or about100 ppi.

The pixel circuits driving the first and second subpixels P1 and P2 maybe electrically connected to the peripheral circuits arranged in theperipheral area DPA, respectively. A first scan driving circuit SDRV1, asecond scan driving circuit SDRV2, a terminal unit PAD, a drivingvoltage supply line 11, and a common voltage supply line 13 may be inthe peripheral area DPA.

The first scan driving circuit SDRV1 may apply a scan signal to each ofthe first pixel circuits PC1 driving the first subpixels P1, through ascan line SL. The first scan driving circuit SDRV1 may apply an emissioncontrol signal to each pixel circuit through an emission control lineEL. The second scan driving circuit SDRV2 may be on the opposite side ofthe first scan driving circuit SDRV1 with respect to the main displayarea MDA and may be substantially parallel to the first scan drivingcircuit SDRV1. Some of the pixel circuits of the first subpixels P1 ofthe main display area MDA may be electrically connected to the firstscan driving circuit SDRV1, and the other ones may be electricallyconnected to the second scan driving circuit SDRV2.

The terminal unit PAD may be at one side of the substrate 100. Theterminal unit PAD may be exposed by not being covered by an insulatinglayer, to be connected to a display circuit board 30. A display driver32 may be on the display circuit board 30.

The display driver 32 may generate a control signal transmitted to thefirst scan driving circuit SDRV1 and the second scan driving circuitSDRV2. The display driver 32 may generate a data signal, and thegenerated data signal may be transmitted to the first pixel circuits PC1through a fan-out wiring FW and a data line DL connected to the fan-outwiring FW.

The display driver 32 may apply a driving voltage ELVDD to the drivingvoltage supply line 11 and may apply a common voltage ELVSS to thecommon voltage supply line 13. The driving voltage ELVDD may be appliedto the pixel circuit of the first and second subpixels P1 and P2 througha driving voltage line PL connected to the driving voltage supply line11, and the common voltage ELVSS may be connected to the common voltagesupply line 13 to be applied to an opposite electrode of the displayelement.

The driving voltage supply line 11 may extend in the first direction(the x-direction) below the main display area MDA. The common voltagesupply line 13 may have a shape in which one side is open in a loopshape, to partially surround the main display area MDA.

In FIG. 3A, two component areas CA1 and CA2 are shown, but two or morecomponent areas may be provided. In this case, a plurality of componentareas are spaced apart from each other, and cameras or sensors may beselectively arranged to correspond to each component area.

According to some example embodiments, the first and second componentareas CA1 and CA2 may be in a circular, elliptical, polygonal, orirregular shape. According to some example embodiments, each of thefirst and second component areas CA1 and CA2 may be in an octagonalshape. The first and second component areas CA1 and CA2 may be inpolygons of various shapes, such as a square and a hexagon. The firstand second component areas CA1 and CA2 may be surrounded by the maindisplay area MDA.

In addition, in FIG. 3A, the second pixel circuit PC2 is spaced apartfrom the first component area CA1 in a second direction (they-direction) in the peripheral area DPA, but embodiments are not limitedthereto. As shown in FIG. 3B, the second pixel circuit PC2 is spaceddiagonally from the first component area CA1 and may be arranged in theperipheral area DPA. According to some example embodiments, theconnection wiring TWL may be connected to the second pixel circuit PC2by an additional connection wiring TWL′. In this case, the connectionwiring TWL may be in the first component area CA1, and the additionalconnection wiring TWL′ may be in the peripheral area DPA. The connectionwiring TWL may include a transparent conductive material, and theadditional connection wiring TWL′ may include a highly conductive metal.According to some example embodiments, the additional connection wiringTWL′ may be on the same layer as the connection wiring TWL. According tosome example embodiments, the additional connection wiring TWL′ may beon a different layer from the connection wiring TWL and connected to theconnection wiring TWL via a contact hole.

According to some example embodiments, when the second subpixels P2 arein the second component area CA2, the corresponding second pixel circuitPC2 may be in the peripheral area DPA adjacent to the second componentarea CA2.

FIG. 4 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments. For example, FIG.4 shows a first component area CA1, a second component area CA2, aportion of a main display area MDA, and a portion of a peripheral areaDPA.

Referring to FIG. 4 , first subpixels P1 may be in the main display areaMDA. The term “subpixel” used herein refers to an emission area fromwhich light is emitted by a display element, as a minimum unitimplementing an image. When an organic light-emitting diode is used as adisplay element, the emission area may be defined by an opening of apixel-defining layer. This will be described later below. Each of thefirst subpixels P1 may emit red, green, blue, or white light.

In FIG. 4 , the first subpixels P1 are arranged in a rectangular shape,but this is for convenience of explanation and illustration, and thefirst subpixels P1 may be arranged in various shapes, such as a pentilematrix structure, a stripe structure, a mosaic array structure, and adelta array structure.

In the main display area MDA, first pixel circuits PC1 may overlap thefirst subpixels P1, respectively, and may be arranged in the firstdirection (the x-direction) and the second direction (the y-direction).In this specification, the first pixel circuit PC1 refers to a unit of apixel circuit that implements one first subpixel P1.

Second subpixels P2 may be in the first component area CA1. Each of thesecond subpixels P2 may emit red, green, blue, or white light.

The number of second subpixels P2 per unit area of the first componentarea CA1 may be less than the number first subpixels P1 per unit area ofthe main display area MDA. For example, the number of second subpixelsP2 and the number of first subpixels P1 arranged per the same area maybe in a ratio of 1:2, 1:4, 1:8, and 1:9. That is, a resolution of thefirst component area CA1 may be ½, ¼, ⅛, 1/9 that of a resolution of themain display area MDA.

The second subpixels P2 in the first component area CA1 may be arrangedin various shapes. Some second subpixels P2 may collectively form apixel group, and the second subpixels P2 may be arranged in variousshapes, such as a pentile structure, a stripe structure, a mosaic arraystructure, and a delta array structure, within the pixel group. In thiscase, a distance between the second subpixels P2 in the pixel group maybe the same as a distance between the first subpixels P1.

Alternatively, as shown in FIG. 4 , the second subpixels P2 may bedistributed within the first component area CA1. That is, the distancebetween the second subpixels P2 may be greater than the distance betweenthe first subpixels P1. Meanwhile, an area of the first component areaCA1 in which the second subpixels P2 are not arranged may be referred toas a transmission area TA having a high light transmittance.

Second pixel circuits PC2 implementing emission of the second subpixelsP2 may be in the peripheral area DPA. Because the second pixel circuitsPC2 are not arranged in the first component area CA1, a size of thetransmission area TA of the first component area CA1 may be increased.In addition, wirings for applying constant voltages and signals to thesecond pixel circuit PC2 are not in the first component area CA1, andthus, the second subpixels P2 may be freely arranged without consideringthe arrangement of the wirings.

The second pixel circuits PC2 may be connected to the second subpixelsP2, respectively, by the connection wirings TWL. The connection wiringTWL may include a transparent conductive material. For example, theconnection wiring TWL may include a transparent conducting oxide (TCO).The connection wiring TWL may include a conductive oxide such as indiumtin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide(In₂O₃), indium gallium oxide (IGO), or aluminum zinc oxide (AZO).

That the connection wiring TWL is connected to the second subpixel P2may mean that the connection wiring TWL is electrically connected to apixel electrode of a display element that implements the second subpixelP2.

According to some example embodiments, subpixels may not be in thesecond component area CA2, unlike in the first component area CA1. Thesecond component area CA2 may include a transmission area TA. Forexample, the transmission area TA may be understood as an opening area.The transmission area TA of the second component area CA2 may be formedby removing the substrate 100 and at least a portion of components onthe substrate 100. According to some example embodiments, the secondsubpixels P2 may be in the second component area CA2 as in the firstcomponent area CA1. When the second subpixels P2 are in the secondcomponent area CA2, the transmission area TA may be reduced in size.

Third subpixels P3 may be between the first component area CA1 and thesecond component area CA2. Each of the third subpixels P3 may emit red,green, blue, or white light.

According to some example embodiments, third pixel circuits PC3implementing emission of the third subpixels P3 may be in the peripheralarea DPA. Because the third pixel circuits PC3 driving the thirdsubpixels P3 are in the peripheral area DPA, an area between the firstcomponent area CA1 and the second component area CA2 is reduced, andthus, the visibility of the display apparatus may be improved.

The third pixel circuits PC3 may be connected to the third subpixels P3,respectively, by the connection wirings TWL. According to some exampleembodiments, the connection wiring TWL may include a transparentconductive material. According to some example embodiments, theconnection wiring TWL may include at least one of aluminum (Al),platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au),nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca),molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu).

That the connection wiring TWL is connected to the third subpixel P3 maymean that the connection wiring TWL is electrically connected to a pixelelectrode of a display element that implements the third subpixel P3.

According to some example embodiments, the third subpixel P3 is betweenthe first component area CA1 and the second component area CA2, whereina smaller number of third subpixels P3 may be arranged in a positionadjacent to the first component area CA1 and the second component areaCA2. That is, the number of third subpixels P3 may decrease from thecenter between the first component area CA1 and the second componentarea CA2 toward a boundary of the first component area CA1 or a boundaryof the second component area CA2. Through this, a pixel density of themain display area MDA between the first component area CA1 and thesecond component area CA2 and a pixel density of an area adjacent to thefirst component area CA1 or the second component area CA2 may bedifferentiated, and thus, the visibility of the display apparatus may beimproved.

A scan line SL may include a main scan line SLm connected to the firstpixel circuits PC1 and an auxiliary scan line SLa connected to thesecond pixel circuits PC2. The main scan line SLm extends in the firstdirection (the x-direction) and may be connected to the first pixelcircuits PC1 in the same row. The main scan line SLm may not be in thefirst and second component areas CA1 and CA2. In other words, the mainscan line SLm may be short-circuited with the first and second componentareas CA1 and CA2 therebetween. In this case, the main scan line SLm onthe left side of the first component area CA1 receives a signal from thefirst scan driving circuit SDRV1 (see FIG. 3A), and the main scan lineSLm on the right side of the second component area CA2 may receive asignal from the second scan driving circuit SDRV2 (see FIG. 3A).

The auxiliary scan line SLa may be connected to the second pixel circuitPC2 driving the second subpixels P2. The main scan line SLm and theauxiliary scan line SLa are connected to each other by a scan connectionwiring SWL, and thus, the same signal may be applied to pixel circuitsdriving the main subpixel Pm and the auxiliary subpixel Pa, which arearranged on the same row.

The scan connection wiring SWL is on a different layer from a layer onwhich the main scan line SLm and the auxiliary scan line SLa arearranged, and may be connected to each of the main scan line SLm and theauxiliary scan line SLa via contact holes. The scan connection wiringSWL may be in the peripheral area DPA.

According to some example embodiments, because the third pixel circuitPC3 driving the third subpixel P3 is in the peripheral area DPA, theauxiliary scan line SLa may be connected to the third pixel circuit PC3driving the third subpixel P3. According to some example embodiments,the main scan line SLm instead of the auxiliary scan line SLa may beconnected to the third pixel circuit PC3.

A data line DL may include a main data line DLm connected to the firstpixel circuits PC1 and an auxiliary data line DLa connected to thesecond pixel circuits PC2. The main data line DLm extends in the seconddirection (the y-direction) and may be connected to the first pixelcircuits PC1 in the same column. The auxiliary data line DLa extends inthe second direction (the y-direction) and may be connected to thesecond pixel circuits PC2 in the same column.

The main data line DLm and the auxiliary data line DLa may be spacedapart from each other with the first component area CA1 therebetween.The main data line DLm and the auxiliary data line DLa are connected toeach other by a data connection line DWL, and the same signal may beapplied to pixel circuits driving the first subpixel P1 and the secondsubpixel P2, which are arranged in the same column.

The data connection line DWL may bypass the first component area CA1.The data connection line DWL may overlap the first pixel circuits PC1arranged in the main display area MDA. As the data connection line DWLis in the main display area MDA, it is not necessary to secure aseparate space in which the data connection line DWL is arranged, andthus, an area of a dead space may be minimized (or significantlyreduced).

The data connection line DWL is on a different layer from a layer onwhich the main data line DLm and the auxiliary data line DLa arearranged, and may be connected to each of the main data line DLm and theauxiliary data line DLa via contact holes.

In FIG. 4 , the connection wiring TWL is integrally provided from theperipheral area DPA to the second subpixels P2 of the first componentarea CA1. However, embodiments are not limited thereto. As describedwith reference to FIG. 3B, the connection wiring TWL may be connected tothe second pixel circuits PC2 through an additional connection wiring.

FIG. 5 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments. The embodimentsdescribed with respect to FIG. 5 are different from the embodimentsdescribed with respect to FIG. 4 in that a dummy subpixel DP is furtherarranged in the peripheral area DPA. In FIG. 5 , the same referencenumerals as those in FIG. 4 refer to the same members, and someredundant description thereof may be omitted.

Referring to FIG. 5 , the dummy subpixel DP may be further arranged inthe peripheral area DPA. The dummy subpixel DP may be connected to theauxiliary scan line SLa. In this case, the dummy subpixel DP may be asubpixel to which actual signals are applied but which does not emitlight. The detailed structure of the dummy subpixel DP will be describedlater below.

No pixel circuit is in the first and second component areas CA1 and CA2.Thus, signal lines that are not in the same row or column as the firstand second component areas CA1 and CA2 pass through a large number ofpixel circuits, but signal lines arranged in the same row or column asthe first and second component areas CA1 and CA2 may pass through fewerpixel circuits than the signal lines not arranged in the same row orcolumn as the first and second component areas CA1 and CA2. Thus, asignal delay occurs, and thus, a difference in luminance may occurbetween the subpixels not arranged in the same row or column as thefirst and second component areas CA1 and CA2 and the subpixels arrangedin the same row or column as the first and second component areas CA1and CA2.

According to some example embodiments, the dummy subpixel DP may be in aposition adjacent to the second pixel circuit PC2 driving the secondsubpixel P2 arranged in the first component area CA1, thus preventing asignal delay from occurring. Thus, the luminance difference between thesubpixels not arranged in the same row or column as the first and secondcomponent areas CA1 and CA2 and the subpixels arranged in the same rowor column as the first and second component areas CA1 and CA2 may beprevented or minimized (or significantly reduced).

FIG. 6 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments. The embodimentsdescribed with respect to FIG. 6 are different from the embodimentsdescribed with respect to FIG. 4 in that the subpixels are not arrangedbetween the first component area CA1 and the second component area CA2.In FIG. 6 , the same reference numerals as those in FIG. 4 refer to thesame members, and some redundant description thereof may be omitted.

Referring to FIG. 6 , a subpixel may not be arranged between the firstcomponent area CA1 and the second component area CA2. Because thesubpixels are not arranged between the first component area CA1 and thesecond component area CA2, the first component area CA1 and the secondcomponent area CA2 may be provided closer together.

FIG. 7 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments. The embodimentsdescribed with respect to FIG. 7 are different from the embodimentsdescribed with respect to FIG. 4 in that the second pixel circuit PC2driving the second subpixel P2 is between the first component area CA1and a second component area CA2. In FIG. 7 , the same reference numeralsas those in FIG. 4 refer to the same members, and some redundantdescription thereof may be omitted.

Referring to FIG. 7 , the second pixel circuits PC2 driving the secondsubpixels P2 arranged in the first component area CA1 may be between thefirst component area CA1 and the second component area CA2. The secondpixel circuit PC2 and a display element implementing the second subpixelP2 may be connected to each other by the connection wiring TWL, whichextends in the first direction (the x-direction) and/or the seconddirection (the y-direction). Because the second pixel circuits PC2 arenot arranged in the first component area CA1, the first component areaCA1 may secure a larger transmission area TA.

According to some example embodiments, some of the scan signals outputfrom the first scan driving circuit SDRV1 (see FIG. 3A) may be appliedto the first pixel circuit PC1 through the main scan line SLm. The mainscan line SLm extending in the first direction (the x-direction) may beconnected to the scan connection wiring SWL that bypasses one side ofthe first component area CA1. The scan connection wiring SWL may bypassone side of the first component area CA1 along the edge of the one sideof the first component area CA1. The scan connection wiring SWL isconnected to the auxiliary scan line SLa between the first componentarea CA1 and the second component area CA2 so that a scan signal may betransmitted to the second pixel circuit PC2. Through this, scan signalsof the same row may be applied to the first and second pixel circuitsPC1 and PC2 arranged in the same row.

The third subpixel P3 may be between the first component area CA1 andthe second component area CA2. The third pixel circuit PC3 driving thethird subpixel P3 is also between the first component area CA1 and thesecond component area CA2, and may overlap the third subpixel P3.

FIG. 8 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments. The embodimentsdescribed with respect to FIG. 8 are different from the embodimentsdescribed with respect to FIG. 4 in that the second pixel circuit PC2driving the second subpixel P2 is between the first component area CA1and the second component area CA2. The embodiments described withrespect to FIG. 8 are different from the embodiments described withrespect to FIG. 7 in that the scan connection wiring SWL is in theperipheral area DPA. In FIG. 8 , the same reference numerals as those inFIGS. 4 and 7 refer to the same members, and some redundant descriptionthereof may be omitted.

Referring to FIG. 8 , some of the scan signals output from the firstscan driving circuit SDRV1 (see FIG. 3A) may be applied to the firstpixel circuit PC1 through the main scan line SLm. The main scan line SLmextending in the first direction (the x-direction) may be connected tothe scan connection wiring SWL arranged in the peripheral area DPA. Thescan connection wiring SWL is arranged in the peripheral area DPA andmay connect the main scan line SLm to the auxiliary scan line SLa. Thescan connection wiring SWL is connected to the auxiliary scan line SLabetween the first component area CA1 and the second component area CA2so that a scan signal may be transmitted to the second pixel circuitPC2. Through this, scan signals of the same row may be applied to thefirst and second pixel circuits PC1 and PC2 arranged in the same row.

FIG. 9 is a schematic plan layout diagram illustrating a partial area ofa display panel according to some example embodiments. The embodimentsdescribed with respect to FIG. 9 are different from the embodimentsdescribed with respect to FIG. 7 in that the dummy subpixel DP isbetween the first component area CA1 and the second component area CA2.In FIG. 9 , the same reference numerals as those in FIG. 7 refer to thesame members, and some redundant description thereof may be omitted.

Referring to FIG. 9 , the dummy subpixel DP may be further arrangedbetween the first component area CA1 and the second component area CA2.As described above, the dummy subpixel DP may be a subpixel to whichactual signals are applied but which does not emit light.

By placing the dummy subpixel DP between the first component area CA1and the second component area CA2, a signal delay is prevented fromoccurring, and thus, the luminance difference between the subpixels notarranged in the same row or column as the first and second componentareas CA1 and CA2 and the subpixels arranged in the same row or columnas the first and second component areas CA1 and CA2 may be prevented orminimized or reduced.

FIG. 10 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 10 are different from theembodiments described with respect to FIG. 7 in that no subpixel isarranged between the first component area CA1 and the second componentarea CA2. In FIG. 10 , the same reference numerals as those in FIG. 7refer to the same members, and some redundant description thereof may beomitted.

Referring to FIG. 10 , a subpixel may not be arranged between the firstcomponent area CA1 and the second component area CA2. Because thesubpixels are not arranged between the first component area CA1 and thesecond component area CA2, the first component area CA1 and the secondcomponent area CA2 may be provided closer together.

FIG. 11 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments.

Referring to FIG. 11 , a display area DA may include a main display areaMDA, a first component area CA1, and a second component area CA2. Firstsubpixels P1 may be in the main display area MDA, and second subpixelsP2 may be in the first component area CA1 and the second component areaCA2. Third subpixels P3 may be in the main display area MDA between thefirst component area CA1 and the second component area CA2.

Because the subpixels in the first component area CA1 and the secondcomponent area CA2 is less dense than the subpixels in the main displayarea MDA, the light transmittance of the first component area CA1 andthe second component area CA2 may be greater than the lighttransmittance of the main display area MDA.

FIG. 12 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 12 differs from theembodiments described with respect to FIG. 11 in that the subpixels inthe first component area CA1 and the second component area CA2 arelarger in size than the subpixels in the main display area MDA. In FIG.12 , the same reference numerals as those in FIG. 11 refer to the samemembers, and some redundant description thereof may be omitted.

Referring to FIG. 12 , the display area DA may include the main displayarea MDA, the first component area CA1, and the second component areaCA2. The first subpixels P1 may be in the main display area MDA, and thesecond subpixels P2 may be in the first component area CA1 and thesecond component area CA2. The third subpixels P3 may be in the maindisplay area MDA between the first component area CA1 and the secondcomponent area CA2.

According to some example embodiments, the second subpixel P2 in thefirst component area CA1 and the second component area CA2 may be largerin size than the first subpixel P1 in the main display area MDA. In moredetail, the first subpixel P1 in the main display area MDA may have afirst area 1A, and the second subpixel P2 in the first component areaCA1 and the second component area CA2 may have a second area 2A greaterthan the first area 1A.

Because the second subpixel P2 in the first component area CA1 and thesecond component area CA2 is larger in size than the first subpixel P1in the main display area MDA, the visibility of the first component areaCA1 and the second component area CA2 may be improved.

According to some example embodiments, the second subpixels P2 in thesecond component area CA2 may be omitted.

FIG. 13 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 13 are different from theembodiments described with respect to FIG. 11 in that no subpixel isbetween the first component area CA1 and the second component area CA2.In FIG. 13 , the same reference numerals as those in FIG. 11 refer tothe same members, and some redundant description thereof may be omitted.

Referring to FIG. 13 , a subpixel may not be arranged between the firstcomponent area CA1 and the second component area CA2. Because nosubpixel is between the first component area CA1 and the secondcomponent area CA2, the first component area CA1 and the secondcomponent area CA2 may be closer together.

FIG. 14 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 14 are different from theembodiments described with respect to FIG. 11 in that no subpixel isarranged in the second component area CA2. In FIG. 14 , the samereference numerals as those in FIG. 11 refer to the same members, andsome redundant description thereof may be omitted.

Referring to FIG. 14 , the display area DA may include the main displayarea MDA and the first component area CA1. The first subpixels P1 may bein the main display area MDA, and the second subpixels P2 may be in thefirst component area CA1. The third subpixels P3 may be in the maindisplay area MDA between the first component area CA1 and the secondcomponent area CA2.

Subpixels may not be in the second component area CA2. Because nosubpixel is in the second component area CA2, the light transmittance ofthe second component area CA2 may be greater than that of the firstcomponent area CA1.

According to some example embodiments, a camera may be in the firstcomponent area CA1 to correspond to the first component area CA1, and athree-dimensional (3D) infrared (IR) sensor, a radar sensor, or the likethat requires high resolution may be in the second component area CA2having a greater light transmittance than the first component area CA1.

FIG. 15 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 15 are different from theembodiments described with respect to FIG. 14 in that a subpixel is notarranged between the first component area CA1 and the second componentarea CA2. In FIG. 15 , the same reference numerals as those in FIG. 14refer to the same members, and some redundant description thereof may beomitted.

Referring to FIG. 15 , a subpixel may not be arranged between the firstcomponent area CA1 and the second component area CA2. Because nosubpixel is arranged between the first component area CA1 and the secondcomponent area CA2, the first component area CA1 and the secondcomponent area CA2 may be provided closer together.

FIG. 16 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 16 are different from theembodiments described with respect to FIG. 14 in that no subpixel isarranged in the first component area CA1. In FIG. 16 , the samereference numerals as those in FIG. 14 refer to the same members, andsome redundant description thereof may be omitted.

Referring to FIG. 16 , the first subpixels P1 may be in the main displayarea MDA. The third subpixels P3 may be in the main display area MDAbetween the first component area CA1 and the second component area CA2.

Subpixels may not be arranged in the first component area CA1 and thesecond component area CA2. Because no subpixel is in the first componentarea CA1 and the second component area CA2, the light transmittance ofthe first component area CA1 and the second component area CA2 may beimproved.

According to some example embodiments, sensors requiring highresolution, such as a 3D IR sensor and a radar sensor, may be arrangedto correspond to the first component area CA1 and the second componentarea CA2 with improved light transmittance.

FIG. 17 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 17 are different from theembodiments described with respect to FIG. 16 in that no subpixel isbetween the first component area CA1 and the second component area CA2.In FIG. 17 , the same reference numerals as those in FIG. 16 refer tothe same members, and some redundant description thereof may be omitted.

Referring to FIG. 17 , a subpixel may not be arranged between the firstcomponent area CA1 and the second component area CA2. Because nosubpixel is between the first component area CA1 and the secondcomponent area CA2, the first component area CA1 and the secondcomponent area CA2 may be provided closer together.

FIG. 18 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments.

Referring to FIG. 18 , the display panel may include the main displayarea MDA, the first component area CA1, the second component area CA2,and a third component area CA3. The first component area CA1, the secondcomponent area CA2, and the third component area CA3 may be spaced apartfrom one another in the first direction (the x-direction).

The display area DA may include the main display area MDA and the firstcomponent area CA1. That is, the first component area CA1 and the maindisplay area MDA may display an image individually or together.

The first subpixels P1 may be in the main display area MDA, and thesecond subpixel P2 may be in the first component area CA1. The thirdsubpixel P3 may be in the main display area MDA between the firstcomponent area CA1 and the second component area CA2, and a fourthsubpixel P4 may be between the second component area CA2 and the thirdcomponent area CA3.

According to some example embodiments, subpixels may not be arranged inthe second component area CA2 and the third component area CA3. Becauseno subpixel is in the second component area CA2 and the third componentarea CA3, the light transmittance of the second component area CA2 andthe third component area CA3 may be improved. Thus, sensors requiringhigh resolution may be arranged below the display panel to correspond tothe second component area CA2 and the third component area CA3.

According to some example embodiments, subpixels may be in the secondcomponent area CA2 or the third component area CA3. By placing thesubpixels in the second component area CA2 or the third component areaCA3, the visibility of the display panel may be improved.

FIG. 19 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 19 are different from theembodiments described with respect to FIG. 18 in that no subpixel isbetween the second component area CA2 and the third component area CA3.In FIG. 19 , the same reference numerals as those in FIG. 18 refer tothe same members, and a redundant description thereof will be omitted.

Referring to FIG. 19 , according to some example embodiments, a subpixelmay not be arranged between the second component area CA2 and the thirdcomponent area CA3. Because no subpixel is between the second componentarea CA2 and the third component area CA3, the second component area CA2and the third component area CA3 may be provided closer together.

According to some example embodiments, a subpixel may not be arrangedbetween the first component area CA1 and the second component area CA2.Because no subpixel is between the first component area CA1 and thesecond component area CA2, the first component area CA1 and the secondcomponent area CA2 may be provided closer together.

FIG. 20 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 20 are different from theembodiments described with respect to FIG. 18 in that the thirdcomponent area CA3 is located in a diagonal direction of the firstcomponent area CA1 and the second component area CA2. In FIG. 20 , thesame reference numerals as those in FIG. 18 refer to the same members,and some redundant description thereof may be omitted.

Referring to FIG. 20 , the first component area CA1 and the secondcomponent area CA2 may be spaced apart from each other in the firstdirection (the x-direction). The third component area CA3 may be spacedapart from each of the first component area CA1 and the second componentarea CA2 in a diagonal direction. For example, the first component areaCA1, the second component area CA2, and the third component area CA3 mayform an inverted triangle shape.

According to some example embodiments, a camera may be in the firstcomponent area CA1 to correspond to the first component area CA1, andsensors requiring high resolution, such as a 3D IR sensor and a radarsensor, may be in the second component area CA2 and the third componentarea CA3 having a greater light transmittance than the first componentarea CA1.

According to some example embodiments, subpixels may be in the secondcomponent area CA2 and/or the third component area CA3. Also, subpixelsmay be between the first component area CA1 and the second componentarea CA2.

FIG. 21 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 21 are different from theembodiments described with respect to FIG. 20 in that a fourth componentarea CA4 is further included. In FIG. 22 , the same reference numeralsas those in FIG. 20 refer to the same members, and some redundantdescription thereof may be omitted.

Referring to FIG. 21 , the first component area CA1 and the secondcomponent area CA2 may be spaced apart from each other in the firstdirection (the x direction), and the third component area CA3 and thefourth component area CA4 may be spaced apart from each other in thefirst direction (the x direction).

The third component area CA3 may be in a diagonal direction of each ofthe first component area CA1 and the second component area CA2, and thefourth component area CA4 may be in a diagonal direction of the secondcomponent area CA2. For example, the first component area CA1, thesecond component area CA2, the third component area CA3, and the fourthcomponent area CA4 may form a rhombus shape.

According to some example embodiments, a camera may be in the firstcomponent area CA1 to correspond to the first component area CA1, andsensors requiring high resolution, such as a 3D IR sensor and a radarsensor, may be in the second component area CA2 to the fourth componentarea CA4 having greater light transmittance than the first componentarea CA1.

According to some example embodiments, subpixels may be in the secondcomponent area CA2, the third component area CA3, and/or the fourthcomponent area CA4. Further, subpixels may be between the firstcomponent area CA1 and the second component area CA2, and between thethird component area CA3 and the fourth component area CA4.

FIG. 22 is a schematic cross-sectional view illustrating a portion of adisplay panel 10 and a portion of a main display area MDA, a firstcomponent area CA1, and a peripheral area DPA according to some exampleembodiments.

Referring to FIG. 22 , a first subpixel P1 may be in the main displayarea MDA, and the first component area CA1 may include a second subpixelP2 and a transmission area TA. A first pixel circuit PC1 including amain thin-film transistor TFT and a main storage capacitor Cst, and amain organic light-emitting diode OLED as a display element connected tothe first pixel circuit PC1 may be in the main display area MDA. Anauxiliary organic light-emitting diode OLED′ may be in the firstcomponent area CA1. A second pixel circuit PC2 including an auxiliarythin-film transistor TFT′ and an auxiliary storage capacitor Cst′ may bein the peripheral area DPA. Meanwhile, a connection wiring TWLconnecting the second pixel circuit PC2 to the auxiliary organiclight-emitting diode OLED′ may be in the first component area CA1 andthe peripheral area DPA.

According to some example embodiments, an organic light-emitting diodeis used as a display element. However, according to some exampleembodiments, an inorganic light-emitting element or a quantum dotlight-emitting element may be used as a display element.

A structure in which elements included in the display panel 10 arestacked will now be described. The display panel 10 may include a stackof a substrate 100, a buffer layer 111, a circuit layer PCL, and adisplay element layer EDL.

The substrate 100 may include an insulating material such as glass,quartz, or polymer resin. The substrate 100 may include a rigidsubstrate or a flexible substrate that is bendable, foldable, orrollable.

The buffer layer 111 may be on the substrate 100 to reduce or block thepenetration of foreign materials, moisture, or ambient air from thebottom of the substrate 100 and may provide a flat surface on thesubstrate 100. The buffer layer 111 may include an inorganic materialsuch as oxide or nitride, or an organic material, or anorganic/inorganic composite, and may include a single-layer ormultilayer structure of an inorganic material and an organic material. Abarrier layer for blocking the penetration of ambient air may be furtherincluded between the substrate 100 and the buffer layer 111. In someembodiments, the buffer layer 111 may include silicon oxide (SiO₂) orsilicon nitride (SiN_(x)).

The circuit layer PCL may be on the buffer layer 111 and may include thefirst and second pixel circuits PC1 and PC2, a first insulating layer112, a second insulating layer 113, a third insulating layer 115, and aplanarization layer 117. The first pixel circuit PC1 may include themain thin-film transistor TFT and the main storage capacitor Cst, andthe second pixel circuit PC2 may include the auxiliary thin-filmtransistor TFT′ and the auxiliary storage capacitor Cst′.

The main thin-film transistor TFT and the auxiliary thin-film transistorTFT′ may be above the buffer layer 111. The main thin-film transistorTFT may include a first semiconductor layer A1, a first gate electrodeG1, a first source electrode S1, and a first drain electrode D1. Themain thin-film transistor TFT may be connected to the main organiclight-emitting diode OLED to drive the main organic light-emitting diodeOLED. The auxiliary thin-film transistor TFT′ may be connected to theauxiliary organic light-emitting diode OLED′ to drive the auxiliaryorganic light-emitting diode OLED′. The auxiliary thin-film transistorTFT′ has a similar structure to a structure of the main thin-filmtransistor TFT, and thus, the description of the auxiliary thin-filmtransistor TFT may be as the description of the main thin-filmtransistor TFT.

According to some example embodiments, the first semiconductor layer A1may be on the buffer layer 111 and may include polysilicon. According tosome example embodiments, the first semiconductor layer A1 may includeamorphous silicon. According to some example embodiments, the firstsemiconductor layer A1 may include an oxide of at least one selectedfrom the group consisting of indium (In), gallium (Ga), stannum (Sn),zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium(Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The firstsemiconductor layer A1 may include a channel area, and a source area anda drain area doped with impurities.

The first insulating layer 112 may cover the first semiconductor layerA1. The first insulating layer 112 may include an inorganic insulatingmaterial such as silicon oxide (SiO₂), silicon nitride (SiN_(X)),silicon oxynitride (SiO_(X)N_(Y)), aluminum oxide (Al₂O₃), titaniumoxide (TiO₂), tantalum oxide (Ta₂O₅), and hafnium oxide (HfO₂), or zincoxide (ZnO₂). The first insulating layer 112 may include a single layeror multiple layers including the above inorganic insulating material.

The first gate electrode G1 may be above the first insulating layer 112to overlap the first semiconductor layer A1. The first gate electrode G1may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti),or the like and may include a single layer or multiple layers. Accordingto some example embodiments, the first gate electrode G1 may be a singlemolybdenum (Mo) layer.

The second insulating layer 113 may cover the first gate electrode G1.The second insulating layer 113 may include an inorganic insulatingmaterial such as silicon oxide (SiO₂), silicon nitride (SiN_(X)),silicon oxynitride (SiO_(X)N_(Y)), aluminum oxide (Al₂O₃), titaniumoxide (TiO₂), tantalum oxide (Ta₂O₅), and hafnium oxide (HfO₂), or zincoxide (ZnO₂). The second insulating layer 113 may include a single layeror multiple layers including the above inorganic insulating material.

An upper electrode CE2 of the main storage capacitor Cst and an upperelectrode CE2′ of the auxiliary storage capacitor Cst′ may be above thesecond insulating layer 113.

In the main display area MDA, the upper electrode CE2 of the mainstorage capacitor Cst may overlap the first gate electrode G1therebelow. The first gate electrode G1 and the first upper electrodeCE2 overlapping each other with the second insulating layer 113therebetween may constitute the main storage capacitor Cst. According tosome example embodiments, the first gate electrode G1 may be a lowerelectrode CE1 of the main storage capacitor Cst. According to someexample embodiments, the first gate electrode G1 and the lower electrodeCE1 may be provided as independent and separate components.

In the peripheral area DPA, the upper electrode CE2′ of the auxiliarystorage capacitor Cst′ may overlap a gate electrode of the auxiliarythin-film transistor TFT′ therebelow. The gate electrode of theauxiliary thin-film transistor TFT′ may be a first lower electrode CE1 aof the auxiliary storage capacitor Cst′. The auxiliary storage capacitorCst′ may further include a second lower electrode CE1 b, which is on thesame layer as a layer on which the first lower electrode CE1 a isarranged. The upper electrode CE2′ of the auxiliary storage capacitorCst′ may overlap the first lower electrode CE1 a and the second lowerelectrode CE1 b. The first lower electrode CE1 a and the second lowerelectrode CE1 b may be electrically connected to each other. With thisconfiguration, the capacitance of the auxiliary storage capacitor Cst′may be greater than that of the main storage capacitor Cst.

The upper electrodes CE2 and CE2′ may each include aluminum (Al),platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au),nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca),molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), andmay each include a single layer or multiple layers of the abovematerial.

The third insulating layer 115 may be formed to cover the upperelectrodes CE2 and CE2′. The third insulating layer 115 may includesilicon oxide (SiO₂), silicon nitride (SiN_(X)), silicon oxynitride(SiO_(X)N_(Y)), aluminum oxide (Al₂O₃), titanium oxide (TiO₂), tantalumoxide (Ta₂O₅), and hafnium oxide (HfO₂), or zinc oxide (ZnO₂). The thirdinsulating layer 115 may include a single layer or multiple layersincluding the above inorganic insulating material.

Each of the first source electrode S1 and the first drain electrode D1may be on the third insulating layer 115. The first source electrodes S1and the first drain electrodes D1 may each include a conductive materialincluding molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), orthe like, and may include a single layer or multiple layers includingthe above material. According to some example embodiments, the firstsource electrode S1 and the first drain electrode D1 may have a Ti/Al/Timultilayer structure.

The connection wiring TWL connected to the second pixel circuit PC2 maybe above the third insulating layer 115. The connection wiring TWL mayextend from the peripheral area DPA to the first component area CA1 sothat the auxiliary organic light-emitting diode OLED′ and the secondpixel circuit PC2 are connected to each other. Also, the data line DLmay be above the third insulating layer 115.

According to some example embodiments, the connection wiring TWL may beconnected with an additional connection wiring TWL′. The additionalconnection wiring TWL′ may be in the peripheral area DPA and connectedto the second pixel circuit PC2, for example, the auxiliary thin-filmtransistor TFT′. The connection wiring TWL may be in the transmissionarea TA of the first component area CA1. The connection wiring TWL mayinclude a different material from a material of the additionalconnection wiring TWL′, wherein the connection wiring TWL is on the samelayer as a layer on which the additional connection wiring TWL′ isarranged. An end of the connection wiring TWL may cover an end of theadditional connection wiring TWL′.

The additional connection wiring TWL′ may include a conductive materialincluding Mo, Al, Cu, Ti, or the like and may include a single layer ormultiple layers including the above material. The additional connectionwiring TWL′ may include the same material as the data line DL.

The connection wiring TWL may include a transparent conductive material.For example, the connection wiring TWL may include a transparentconducting oxide (TCO). The connection wiring TWL may include aconductive oxide such as indium tin oxide (ITO), indium zinc oxide(IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indium gallium oxide(IGO), or aluminum zinc oxide (AZO).

The additional connection wiring TWL′ may have a greater conductivitythan the connection wiring TWL. Because the additional connection wiringTWL′ is in the peripheral area DPA, it is not necessary to secure lighttransmittance, and thus, a material having a less light transmittancebut having a greater conductivity than the connection wiring TWL may beused.

According to some example embodiments, the additional connection wiringTWL′ may be omitted. In this case, the connection wiring TWL may bedirectly electrically connected to the auxiliary thin-film transistorTFT′.

The planarization layer 117 may cover the first source electrode S1, thefirst drain electrode D1, and the connection wiring TWL. Theplanarization layer 117 may have a flat upper surface so that a firstpixel electrode 121 and a second pixel electrode 121′ located on theplanarization layer 117 may be formed flat.

The planarization layer 117 may include an organic material or aninorganic material and may have a single-layer structure or a multilayerstructure. The planarization layer 117 may include a first planarizationlayer 117 a and a second planarization layer 117 b. Thus, a conductivepattern such as a wiring may be formed between the first planarizationlayer 117 a and the second planarization layer 117 b, which may enablerelatively high integration. Connection electrodes CM and CM′ and a dataconnection line DWL may be above the first planarization layer 117 a.

The planarization layer 117 may include benzocyclobutene (BIB),polyimide, hexamethyldisiloxane (HMDSO), a general-purpose polymer suchas polymethyl methacrylate (PMMA) or polystyrene (PS), a polymerderivative having a phenol-based group, an acrylic polymer, animide-based polymer, an aryl ether-based polymer, an amide-basedpolymer, a fluorinated polymer, a p-xylene-based polymer, or a vinylalcohol-based polymer. Meanwhile, the planarization layer 117 mayinclude an inorganic insulating material such as silicon oxide (SiO₂),silicon nitride (SiN_(X)), silicon oxynitride (SiO_(X)N_(Y)), aluminumoxide (Al₂O₃), titanium oxide (TiO₂), tantalum oxide (Ta₂O₅), andhafnium oxide (HfO₂), or zinc oxide (ZnO₂). When the planarization layer117 is formed, after the planarization layer 117 is formed, chemicalmechanical polishing may be performed on an upper surface of the layerto provide a flat upper surface thereon.

The first planarization layer 117 a may cover the pixel circuits PC andPC′. The second planarization layer 117 b may be on the firstplanarization layer 117 a and may have a flat upper surface so that thefirst and second pixel electrodes 121 and 121′ may be formed flat.

The main and auxiliary organic light-emitting diodes OLED and OLED′ maybe on the second planarization layer 117 b. The first and second pixelelectrodes 121 and 121′ of the main and auxiliary organic light-emittingdiodes OLED and OLED′ may be connected to the pixel circuits PC and PC′,respectively, through the connection electrodes CM and CM′ each arrangedon the first planarization layer 117 a.

The first pixel electrode 121 and the second pixel electrode 121′ mayinclude a conductive oxide such as indium tin oxide (ITO), indium zincoxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indium galliumoxide (IGO), or aluminum zinc oxide (AZO). The first pixel electrode 121and the second pixel electrode 121′ may include a reflection layerincluding silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt),palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir),chromium (Cr), or any compound thereof. For example, each of the firstpixel electrode 121 and the second pixel electrode 121′ may have astructure in which films including ITO/IZO, ZnO, or In₂O₃ areabove/below the reflective film described above. In this case, the firstpixel electrode 121 and the second pixel electrode 121′ may have a stackstructure of ITO/Ag/ITO.

In FIG. 22 , the connection wiring TWL, the first pixel electrode 121,and the second pixel electrode 121′ are on different layers, but may beon the same layer. When the connection wiring TWL, the first pixelelectrode 121, and the second pixel electrode 121′ are on the samelayer, the connection wiring TWL, the first pixel electrode 121, and thesecond pixel electrode 121′ may be formed in the same process by using ahalftone mask.

For example, after stacking ITO/Ag/ITO in order, a halftone mask is usedfor a portion where the connection wiring TWL is to be formed, and thus,the first pixel electrode 121 and the second pixel electrode 121′ mayeach have a stack structure of ITO/Ag/ITO, and the connection wiring TWLmay include ITO. Through this, the resistance of the connection wiringTWL may be reduced while providing the transparent connection wiringTWL.

A pixel-defining layer 119 is located on the planarization layer 117 tocover an edge of each of the first pixel electrode 121 and the secondpixel electrode 121′, and may have a first opening OP1 and a secondopening OP2 respectively exposing central portions of the first pixelelectrode 121 and the second pixel electrode 121′. Sizes and shapes ofemission areas of the main and auxiliary organic light-emitting diodesOLED and OLED′, that is, the first and second sub-pixels P1 and P2, maybe defined by the first opening OP1 and the second opening OP2,respectively.

The pixel-defining layer 119 may prevent an arc or the like fromoccurring on the edge of each of the first and second pixel electrodes121 and 121′ by increasing a distance between the edge of each the firstand second pixel electrodes 121 and 121′ and an opposite electrode 123located over the first and second pixel electrodes 121 and 121′. Thepixel-defining layer 119 may include an organic insulating material suchas polyimide, polyamide, acrylic resin, BCB, HMDSO, or phenolic resin byusing spin coating or the like.

A first emission layer 122 b and a second emission layer 122 b′, whichare formed to correspond to the first pixel electrode 121 and the secondpixel electrode 121′, respectively, may be located in the first openingOP1 and the second opening OP2 of the pixel-defining layer 119,respectively. The first emission layer 122 b and the second emissionlayer 122 b′ may include a high molecular weight material or a lowmolecular weight material and may emit red, green, blue, or white light.

An organic functional layer 122 e may be over and/or under the firstemission layer 122 b and the second emission layer 122 b′. The organicfunctional layer 122 e may include a first functional layer 122 a and/ora second functional layer 122 c. The first functional layer 122 a or thesecond functional layer 122 c may be omitted.

The first functional layer 122 a may be under the first emission layer122 b and the second emission layer 122 b′. The first functional layer122 a may include a single layer or multiple layers including an organicmaterial. The first functional layer 122 a may include a hole transportlayer (HTL) having a single-layer structure. Alternatively, the firstfunctional layer 122 a may include a hole injection layer (HIL) and anHTL. The first functional layer 122 a may be integrally formed tocorrespond to the main and auxiliary organic light-emitting diodes OLEDand OLED′ respectively included in the main display area MDA and thefirst component area CA1.

The second functional layer 122 c may be above the first emission layer122 b and the second emission layer 122 b′. The second functional layer122 c may include a single layer or multiple layers including an organicmaterial. The second functional layer 122 c may include an electrontransport layer (ETL) and/or an electron injection layer (EIL). Thesecond functional layer 122 c may be integrally formed to correspond tothe main and auxiliary organic light-emitting diodes OLED and OLED′respectively included in the main display area MDA and the firstcomponent area CA1.

The opposite electrode 123 may be above the second functional layer 122c. The opposite electrode 123 may include a conductive material having alow work function. For example, the opposite electrode 123 may include a(semi-)transparent layer including silver (Ag), magnesium (Mg), aluminum(Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium(Nd), iridium (Ir), chrome (Cr), lithium (Li), calcium (Ca), or an alloythereof. Alternatively, the opposite electrode 123 may further include alayer including ITO, IZO, ZnO, or In₂O₃, on the (semi-)transparent layerincluding the above material.

According to some example embodiments, the opposite electrode 123 may beintegrally formed to correspond to the main and auxiliary organiclight-emitting diodes OLED and OLED′ respectively included in the maindisplay area MDA and the first component area CA1. According to someexample embodiments, the opposite electrode 123 may be patterned andformed above the second functional layer 122 c. For example, theopposite electrode 123 may be patterned by forming a material includedin the opposite electrode 123 on the entire surface of the substrate100, and then removing a portion thereof corresponding to thetransmission area TA through laser lift off. The opposite electrode 123may be patterned through a metal self patterning (MSP) method, and theopposite electrode 123 may be patterned by depositing the oppositeelectrode 123 by using a fine metal mask (FMM).

The layers from the first pixel electrode 121 to the opposite electrode123 formed in the main display area MDA may form the main organiclight-emitting diode OLED. The layers from the second pixel electrode121′ to the opposite electrode 123′ formed in the first component areaCA1 may form the auxiliary organic light-emitting diode OLED′.

An upper layer 150 including an organic material may be on the oppositeelectrode 123. The upper layer 150 may protect the opposite electrode123 and improve light extraction efficiency. The upper layer 150 mayinclude an organic material having a greater refractive index than theopposite electrode 123. Alternatively, the upper layer 150 may be astack of layers having different refractive indices. For example, theupper layer 150 may include a stack of a high refractive index layer/alow refractive index layer/a high refractive index layer. In this case,a refractive index of the high refractive index layer may be about 1.7or more, and a refractive index of the low refractive index layer may beabout 1.3 or less.

The upper layer 150 may further include lithium fluoride (LiF).Alternatively, the upper layer 150 may further include an inorganicinsulating material such as silicon oxide (SiO₂), silicon nitride(SiN_(x)), and silicon oxynitride (SiO_(X)N_(Y)).

FIG. 23 is a schematic cross-sectional view illustrating a portion ofthe display panel 10 according to some example embodiments. In FIG. 23 ,the same reference numerals as those in FIG. 22 refer to the samemembers, and a redundant description thereof will be omitted.

Referring to FIG. 23 , the display panel 10 may include the main displayarea MDA, the first component area CA1, and the peripheral area DPA. Thefirst subpixel P1 is in the main display area MDA, and the firstcomponent area CA1 may include the second subpixel P2 and thetransmission area TA. The first pixel circuit PC1 including the mainthin-film transistor TFT and the main storage capacitor Cst, and themain organic light-emitting diode OLED as a display element connected tothe first pixel circuit PC1 may be in the main display area MDA. Theauxiliary organic light-emitting diode OLED′ may be in the firstcomponent area CA1. The second pixel circuit PC2 including the auxiliarythin-film transistor TFT′ and the auxiliary storage capacitor Cst′ maybe in the peripheral area DPA. Meanwhile, the connection wiring TWLconnecting the second pixel circuit PC2 to the auxiliary organiclight-emitting diode OLED′ may be in the component area CA and theperipheral area DPA.

According to some example embodiments, an inorganic insulating layer ILof the display panel 10 may include a hole corresponding to the firstcomponent area CA1.

For example, the first insulating layer 112, the second insulating layer113, and the third insulating layer 115 may be collectively referred toas the inorganic insulating layer IL, and the inorganic insulating layerIL may have a first hole H1 corresponding to the transmission area TA.The first hole H1 may expose a portion of the upper surface of thebuffer layer 111 or the substrate 100. The first hole H1 may be formedby overlapping an opening of the first insulating layer 112 and anopening of the second insulating layer 113, and an opening of the thirdinsulating layer 115, which are formed to correspond to the firstcomponent area CA1, with one another. These openings may be separatelyformed through separate processes or may be simultaneously formedthrough the same process. When the openings are formed by using separateprocesses, an inner surface of the first hole H1 may not be smooth andmay have a staircase-shaped step.

According to some example embodiments, the connection wiring TWL may beinside the first hole H1. The connection wiring TWL may be on the bufferlayer 111 in the first component area CA1. Such a connection wiring TWLis connected via a contact hole to the additional connection wiring TWL′arranged on the first planarization layer 117 a, and may be connected tothe second pixel circuit PC2 through the additional connection wiringTWL′. The other end of the connection wiring TWL is connected to theconnection electrode CM′ via a contact hole, and the connection wiringTWL may be connected to the second pixel electrode 121′ by theconnection electrode CM′.

FIG. 24 is a schematic cross-sectional view illustrating a portion of adisplay panel 10 according to some example embodiments. In FIG. 24 , thesame reference numerals as those in FIG. 22 refer to the same members,and a redundant description thereof will be omitted.

Referring to FIG. 24 , the inorganic insulating layer IL of the displaypanel 10 may include a groove GR corresponding to the first componentarea CA1. For example, referring to the first insulating layer 112, thesecond insulating layer 113, and the third insulating layer 115collectively as the inorganic insulating layer IL, the first insulatinglayer 112 and the second insulating layer 113 are continuously arrangedover the first component area CA1, and the third insulating layer 115may have an opening 115 a corresponding to the first component area CA1.Alternatively, unlike illustrated, the first insulating layer 112 or thesecond insulating layer 113 may also have an opening corresponding tothe first component area CA1. Accordingly, the groove GR may be providedby removing a portion of the inorganic insulating layer IL. Such agroove GR may be provided by removing a layer including silicon nitride(SiN_(X)) from the layers forming the inorganic insulating layer IL.Because the silicon nitride (SiN_(X)) has a high reflectance, thetransmittance of the first component area CA1 may be improved byremoving the layer including the silicon nitride (SiN_(X)).

According to some example embodiments, the connection wiring TWL may beon the second insulating layer 113 inside the groove GR. The connectionwiring TWL may be connected to the second pixel circuit PC2 through theadditional connection wiring TWL′ arranged on the first planarizationlayer 117 a.

FIG. 25 is a schematic cross-sectional view illustrating a portion of adisplay panel 10 according to some example embodiments. For example,FIG. 25 is a diagram illustrating a process of removing the organicfunctional layer 122 e, the opposite electrode 123, and the upper layer150 on the transmission area TA by laser lift off.

Referring to FIG. 25 , the substrate 100 may include a first base layer101, a first barrier layer 102, a second base layer 103, and a secondbarrier layer 104. The first base layer 101 and the second base layer103 may include a polymer resin having high thermal resistance. Forexample, the first base layer 101 and the second base layer 103 may eachinclude one or more materials selected from the group consisting ofpolyethersulfone, polyacrylate, polyether imide, polyethylenenaphthalate, polyethylene terephthalate, polyphenylene sulfide,polyarylate, polyimide, polycarbonate, cellulose triacetate, celluloseacetate propionate, and polyarylene ethersulfone. For example, the firstbase layer 101 and the second base layer 103 may each include polyimide.The first barrier layer 102 and the second barrier layer 104 may eachinclude one material from among silicon nitride (SiN_(x)), silicon oxide(SiO_(x)), aluminum oxide (Al₂O₃), and zirconium oxide (Zr₂O₃). Thefirst barrier layer 102 and the second barrier layer 104 may block thepenetration of ambient air.

A bottom metal layer BML may be on the substrate 100. For example, thebottom metal layer BML may be on the second barrier layer 104. Thebuffer layer 111, the first insulating layer 112, the second insulatinglayer 113, the third insulating layer 115, and the planarization layer117 may be sequentially arranged on the bottom metal layer BML. Athin-film transistor may be between the insulating layers and theplanarization layers.

The second pixel electrode 121′ and the pixel-defining layer 119 may beon the planarization layer 117, and the organic functional layer 122 eincluding the first functional layer 122 a and the second functionallayer 122 c, the opposite electrode 123, and the upper layer 150 may beon the second pixel electrode 121′.

According to some example embodiments, the organic functional layer 122e, the opposite electrode 123, and the upper layer 150, which are on thetransmission area TA, may be removed using a sacrificing layer 125. Forexample, the organic functional layer 122 e, the opposite electrode 123,and the upper layer 150 formed on the transmission area TA along withthe sacrificial layer 125 may be removed through laser lift off by usingthe bottom metal layer BML as a mask. An end 123 a of the oppositeelectrode 123 may coincide with at least one of an end 125 a of thesacrificing layer 125, an end 122 ea of the organic functional layer 122e, or an end 150 a of the upper layer 150. At this time, the sacrificinglayer 125 may include silver (Ag) used to form the second pixelelectrode 121′, and a thickness of the bottom metal layer BML may beabout 2,000 angstroms (Å) to about 3,000 angstroms (Å).

FIG. 26 is a schematic plan layout diagram illustrating a partial areaof a display panel according to some example embodiments. Theembodiments described with respect to FIG. 26 are different from theembodiments described with respect to FIG. 5 in that a signal lineapplied to the dummy subpixel DP is in a zigzag shape. In FIG. 26 , thesame reference numerals as those in FIG. 5 refer to the same members,and some redundant description thereof may be omitted.

Referring to FIG. 26 , signal lines applied to the dummy subpixel DP maybe provided in a zigzag shape. In more detail, the auxiliary scan lineSLa applied to the dummy subpixel DP may be in a zigzag shape.

By providing the signal line applied to the dummy subpixel DP in azigzag shape, a signal delay is prevented, and the luminance differencebetween subpixels not arranged on the same row or column as the firstand second component areas CA1 and CA2 and subpixels arranged on thesame row or column as the first and second component areas CA1 and CA2may be prevented, minimized, or reduced.

FIG. 27A to 27D are schematic cross-sectional views each illustrating apartial area of a display panel according to some example embodiments.For example, FIGS. 27A to 27D are cross-sectional views eachillustrating a stack structure of the dummy subpixel DP.

Referring to FIG. 27A, the dummy subpixel DP may include a dummythin-film transistor DAFT and a dummy storage capacitor DCst. The dummythin-film transistor DTFT may include a dummy semiconductor layer DA, adummy gate electrode DG, a dummy drain electrode DD, and a dummy sourceelectrode DS. The dummy storage capacitor DCst may include a dummy lowerelectrode 144 and a dummy upper electrode 146. In addition, the dummysubpixel DP may include a dummy driving voltage DELVDD connected to thebottom metal layer BML, and a dummy connection electrode DCM connectedto the dummy drain electrode DD or dummy source electrode DS.

The dummy subpixel DP may include a dummy pixel electrode D210 on thedummy connection electrode DCM, and a dummy emission layer D122 b.However, the dummy connection electrode DCM and the dummy pixelelectrode D210 of the dummy subpixel DP may not be electricallyconnected to each other.

Therefore, because the dummy connection electrode DCM and the dummypixel electrode D210 are not electrically connected to each other, thedummy subpixel DP may not emit light, even when actual signals areapplied to the dummy subpixel DP.

In FIG. 27A, the dummy subpixel DP includes the dummy thin-filmtransistor DTFT, the dummy storage capacitor DCst, the dummy pixelelectrode D210, and the dummy emission layer D122 b. However, as shownin FIG. 27B, the dummy subpixel DP may not include the dummy pixelelectrode D210 in the structure shown in FIG. 27A. As shown in FIG. 27C,the dummy subpixel DP may not include the dummy pixel electrode D210 andthe dummy emission layer D122 b in the structure as shown in FIG. 27A.As shown in FIG. 27D, the dummy subpixel DP may not include the dummyemission layer D122 b in the structure as shown in FIG. 27A.

FIGS. 28 and 29 are perspective views each illustrating a displayapparatus in use according to some example embodiments. For example,FIGS. 28 and 29 are perspective views each illustrating a displayapparatus 1 included in a vehicle.

Referring to FIG. 28 , the display apparatus 1 according to some exampleembodiments may be used as a display apparatus for a vehicle. Forexample, the display apparatus 1 may include a display area DA thatincludes a main display area MDA in which first subpixels are arranged,and a first component area CA1 in which second subpixels are arranged.In addition, a second component area CA2 where no subpixel is arrangedmay be at locations of a gear transmission, a sound control button, anemergency flashing button. In this case, because subpixels are in themain display area MDA and the first component area CA1, the main displayarea MDA and the first component area CA1 may display imagesindividually or together. For example, the main display area MDA maydisplay a navigation screen, and the first component area CA1 may be onone side of the main display area MDA to display the navigation screentogether with the main display area MDA. In addition, the main displayarea MDA and the first component area CA1 may display not only thenavigation screen, but also weather, buttons, and interior/exteriorenvironments of the vehicle, individually or together.

In this case, components such as a camera may be under the firstcomponent area CA1, and sensors requiring high resolution may be underthe second component area CA2.

Referring to FIG. 29 , an instrument panel of a vehicle may be a digitalinstrument panel. The digital instrument panel is provided as thedisplay apparatus 1 including the display area DA, and may provideinformation on a vehicle speed and a current state to a user through animage.

According to some example embodiments, the display apparatus 1 mayinclude the display area DA for displaying an image. The display area DAmay include a main display area MDA and a first component area CA1 belowwhich a camera or the like is arranged.

The display apparatus 1 may recognize a face shape, mood, and facialexpressions of the driver or passenger through a camera below the firstcomponent area CA1.

In addition, the display apparatus 1 may include a second component areaCA2 below which a 3D image sensor is arranged. The display apparatus 1may output a 3D image through the 3D image sensor in the secondcomponent area CA2.

According to some example embodiments, no pixel circuit is in acomponent area of a display panel and a display apparatus having thedisplay panel, and thus, a larger transmission area may be secured, andthe transmittance may be improved. However, the scope of the disclosureis not limited by the effects.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments. While one or more embodiments have beendescribed with reference to the figures, it will be understood by thoseof ordinary skill in the art that various changes in form and detailsmay be made therein without departing from the spirit and scope asdefined by the following claims, and their equivalents.

What is claimed is:
 1. A display panel comprising: a substratecomprising a main display area, a first component area, a secondcomponent area, and a peripheral area; a first subpixel on the maindisplay area, and a first pixel circuit connected to the first subpixel;a second subpixel on the first component area; a second pixel circuitspaced apart from the second subpixel; and a connection wiringconnecting the second subpixel to the second pixel circuit, wherein thesecond pixel circuit is between the first component area and the secondcomponent area.
 2. The display panel of claim 1, wherein the secondpixel circuit is in the peripheral area.
 3. The display panel of claim1, wherein the connection wiring comprises a transparent conductivematerial.
 4. The display panel of claim 3, further comprising anadditional connection wiring connecting the connection wiring to thesecond pixel circuit, wherein the additional connection wiring includesa material different from a material of the connection wiring.
 5. Thedisplay panel of claim 1, wherein the first subpixel and the secondsubpixel are configured to emit a same color of light, and a size of thesecond subpixel is greater than a size of the first subpixel.
 6. Adisplay panel comprising: a substrate comprising a main display area, afirst component area, a second component area, and a peripheral area; afirst subpixel on the main display area, and a first pixel circuitconnected to the first subpixel; a second subpixel on the firstcomponent area; a second pixel circuit spaced apart from the secondsubpixel; a connection wiring connecting the second subpixel to thesecond pixel circuit; and a third subpixel between the first componentarea and the second component area.
 7. The display panel of claim 6,wherein the third subpixel is connected to a third pixel circuit in theperipheral area.
 8. The display panel of claim 1, further comprising: amain scan line extending in a first direction, and a scan connectionline connected to the main scan line.
 9. The display panel of claim 8,wherein the scan connection line surrounds one side of the firstcomponent area.
 10. The display panel of claim 8, wherein the scanconnection line is in the peripheral area.
 11. The display panel ofclaim 1, wherein the first subpixel comprises a first pixel electrodeand a first emission layer, and the second subpixel comprises a secondpixel electrode and a second emission layer.
 12. The display panel ofclaim 11, further comprising: an opposite electrode on each of the firstemission layer and the second emission layer; and an upper layer on theopposite electrode, wherein an end of the opposite electrode and an endof the upper layer coincide with each other.
 13. The display panel ofclaim 11, wherein the first pixel electrode or the second pixelelectrode and the connection wiring are formed by a same process. 14.The display panel of claim 1, further comprising a bottom metal layer onthe first component area.
 15. The display panel of claim 14, furthercomprising a dummy subpixel is the peripheral area or the firstcomponent area and the second component area.
 16. The display panel ofclaim 1, wherein the substrate further comprises a third component area.17. A display apparatus comprising: a display panel comprising asubstrate, the substrate comprising a main display area, a firstcomponent area, a second component area, and a peripheral area; a firstcomponent below the display panel corresponding to the first componentarea; and a second component below the display panel corresponding tothe second component area, wherein the display panel comprises: a firstsubpixel on the main display area, and a first pixel circuit connectedto the first subpixel; a second subpixel on the first component area; asecond pixel circuit spaced apart from the second subpixel; and aconnection wiring connecting the second subpixel to the second pixelcircuit, wherein the second pixel circuit is between the first componentarea and the second component area.
 18. The display apparatus of claim17, wherein the first component and the second component each compriseat least one of a proximity sensor, an illuminance sensor, an RGBsensor, an infrared sensor, a fingerprint recognition sensor, anultrasonic sensor, an optical sensor, a microphone, an environmentalsensor, a chemical sensor, or a radar sensor.
 19. The display apparatusof claim 18, wherein the substrate further comprises a third componentarea, and the display apparatus further comprises a third componentcorresponding to the third component area.